Advanced Plating Solutions for Increased Yields and Reduced Costs 


The TechniPad ENIG & ENEPIG processes are engineered to increase first pass yields while reducing costs in both fabrication and assembly.  Whether it’s fine pitch assembly on high TG material or high speed applications with tight lines and spaces, only TechniPad can provide the consistency required for today’s advanced electronics.

Technic's advanced ENIG and ENEPIG plating solutions eliminate corrosion and provide cost savings through superior thickness consistency, even with fine features on high speed laminates. TechniPad processes are engineered for advanced fabrication and assembly with a flat surface yielding excellent wire bond strength, superior solderability, and  low contact resistance for touch and slide contacts.

Assembly:

TechniPad ENEPIG

  • Proprietary reducing agent yields a stable solution with long bath life
  • Capable of high Pd thickness
  • Excellent solderbility
  • Low contact resistance

Fabrication:

TechniPad Pd 7611

  • Pure Palladium deposit using proprietary reducing agent
  • Tight thickness distribution
  • Lowest operating cost

Fabrication:

TechniPad ENIG

  • World Class Solderability
  • Lowest Operating Cost
  • Reduced Precious Metal Usage