Industry Leading  Photoimageable Solder Mask

Our LDI and UV compatible photoimagable inks, either epoxy or polyimide based, are ideal for creating intricate PWB circuit patterns with precision, particularly for flex circuit production.

Black Liquid Soldermask for Flexible Fine Pitch Direct Imaging

  • Ideal for demanding assembly conditions
  • No cracking – durable and flexible
  • Less than 10 microns of undercut
  • High resolution
  • Superior chemical resistance

Technic ECO ProductsTechniFlex LCL 1000F/423M is ideally suited for demanding assembly conditions, including hot-bar soldering or multiple lead-free reflows. Extensive testing of TechniFlex 423M has shown no cracking after multiple 180 degree bends, even when processing 12-micron polyimide substrate.
This product is RoHS compliant and free from bisphenol A, halogen, Sb, Be and phthalate.

TechniFlex LCL 1000F/423M provides exceptionally fine resolution in a matte black product. With less than 10 microns of undercut, TechiFlex LCL 1000F/423M consistently provides high resolution on 50-micron solder dams with excellent chemical resistance to ENIG, ENEPIG, Ag and Sn finishes.

TechniFlex LCL 1000F/423M is available in three versions:

  • TechniFlex LCL 1000F/423M U6 - for direct imaging/manual exposure
  • TechniFlex LCL 1000F/423M U7 - for either direct imaging/manual exposure or roll to roll coating operations
  • TechniFlex LCL 1000F/423M U8 - Next generation black direct image high heat resistance flexible solder mask

TechniFlex LCL1000F/423M U8 Fact Sheet

Additional Information on this product series

Additional Information on Techniflex LCL1000F/423M