Achieve Optimum Side-to-Side and Edge-to-Edge Uniformity
Technic’s MP200CS is an advanced roll-to-roll wet processing system that offers a variety of key benefits for today’s flexible printed circuits, metal foils, and other flexible substrates. Vertical processing is acknowledged as the preferred method for achieving optimum side-to-side and edge-to-edge uniformity.
The MP200CS is the ideal production tool for:
- Base and precious metal plating
- Copper seed, overall panel and pattern plate
- Alloy plating
- Electrocoating
- Electroforming
- Electropolishing
- Chemical etching
- Chemical cleaning
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Features and Benefits
- Superior plating with no pits or voids caused by trapped gases
- Flexible platform for roll, panel, or cut sheet formats
- Stable clip mounting platform provides superior dimensional stability
- Single continuous plating cell eliminates step plating
- Repeatable performance with high Cpk
- Bottom transport option with minimal surface contact
- Material handling eliminates scratching, creasing, denting, buckling defects
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Advanced Cell Design
- Isolated cathode compartment, triple filtration, and enclosed tank design provide for cleanest operation
- Anode membrane eliminates oxidation of organic additive
- Adjustable 3-dimensional shield components provide excellent distribution control
- Thickness uniformity to +/-5%
- Current density to 10ASD
- Homogeneous plating with no layer separation
- Choice of titanium basket or IrO insoluble anode
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Material Handling
- Total tension from 1kg
- Material width to 600mm
- Film thickness from 12 micron
- Line speed to 40m/min
- Vertical and horizontal spindle orientation
- Edge trimming option
- Auto roll change accumulator
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Plating Performance
- Uniform horizontal and vertical distribution
- Plating current flows perpendicular to cathode
- Advanced shielding eliminates edge effects and enables differential plating
- Improved performance with DSA