TechniPad ENIG & ENEPIG: Advanced PCB Assembly Solutions


TechniPad ENIG and ENEPIG plating processes are next generation solutions in printed circuit board (PCB) manufacturing. Our ground-breaking formulas offer high first pass fabrication and assembly yields while eliminating corrosion and providing significant cost savings in both fabrication and assembly.

Assembly on PCB

TechniPad ENIG and ENEPIG

ENIG and ENEPIG processes include:

  • Precise activation catalyst (Techni Catalyst AT 4608)
  • Flat electroless Nickel deposit (Technic EN AT 5600)
  • Stable electroless Palladium (TechniPad PD 7611)
  • Non-cyanide immersion Gold (TechniPad Au 6100)
Key Features & Benefits


Features of TechniPad ENIG and ENEPIG processes include:

  • High wire bond strength
  • Excellent solderability
  • Low contact resistance for touch and slide contacts

Benefits of the TechniPad ENIG and ENEPIG processes include greater efficiency and cost savings via: 

  • Increased first pass fabrication and assembly yields
  • Superior thickness consistency (even with fine features on high speed laminates)
  • Reduced waste generation
  • Reduced precious metal usage

   

Wire Bond on Printed Circuit Board finished with TechniPad ENEPIG

High Wire Bond Strengths

  • Consistent Palladium deposit
  • Capable of high Pd thickness
Download Wire Bond Data

   

TechniPad ENIG & ENEPIG Processes Yield Excellent Solderability in PCB Assembly

Excellent Solderability

  • No electroless nickel corrosion
  • Superior protection of EN
 
Download Solderability Data

   

TechniPad ENIG & ENEPIG processes exhibit low contact resistance

Low Contact Resistance

  • Low coefficient of friction
  • Palladium provides lubricity for contacts
 
Download Contact Resistance Data

   

PCB Assembly Surface Mounting

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