Technic Releases Cu 128

New Versatile Acid Copper for High-Speed PCB Plating

Cranston, RI, USA - Technic is pleased to announce the release of Technic Cu 128, a newly developed acid copper plating process for both flexible and rigid PCB applications. CU128 has proven to be especially versatile in high-speed plating operations where it is capable of achieving current densities above 10 ASD (100ASF). Cu 128 is specifically formulated to double current productivity without having to invest in new equipment. The Cu 128 deposit is extremely ductile, passing over 1000 bends and providing over 25% elongation. Technic’s Cu 128 can be used with either soluble or Technic ISA insoluble anodes.

Technic Cu 128 is part of Technic’s CPS (Complete Process Solution) for vertical copper plating. The entire system of chemistry (Technic Cu 128), equipment (Technic MP200), and analytical control (Technic EBA), provides a complete solution for ultra-thin material transport, throwing power, and a high performance deposit. By providing the complete solution, Technic CPS improves first pass yields, reduces cycle time, reduces equipment investment, and improves capability for advanced designs. Experience has shown that plating advanced product requires the advanced solutions the Technic CPS for Vertical Copper Plating delivers.