Polyimide Resin-Based Solder Resists

 

Technic IRP Series Thermosetting InksTechnic's IRP Series of polyimide resin-based screenable thermoset solder resists is engineered to meet the demanding requirements of modern electronic assemblies. These advanced inks are renowned for their exceptional heat resistivity, maintaining robust performance even with low-temperature post-curing processes. Whether exposed to extreme thermal conditions or complex manufacturing environments, the IRP Series delivers reliable and consistent results.

Key Features:

  • Superior Heat Resistance: With a formulation designed to withstand high temperatures, the IRP Series ensures the integrity of your assemblies, even in the most challenging environments.

  • Outstanding Flexibility: Ideal for complex, multidimensional assemblies, the IRP Series offers excellent flexibility, allowing for tight component pitches without compromising performance.

  • Low-Temperature Post-Curing: The unique formulation of the IRP Series allows for effective curing at lower temperatures, reducing thermal stress on sensitive components and substrates.

The IRP Series is the go-to solution for manufacturers seeking high-performance solder resists that provide durability, flexibility, and reliability in demanding applications. Whether you're working with advanced electronics or intricate component assemblies, the IRP Series offers the perfect balance of heat resistivity and adaptability to ensure optimal results.

Applications:

  • Multidimensional assembly processes
  • Tight component pitch configurations
  • High-temperature environments

Polymide Screenable/Thermal Curing Inks

IRP 1405 NSI-1S (Brown) and IRP 1405 NSI (Blue)

IRP 1800W (White)