Application Notes provides additional information on a variety of procedures for cleaning, testing, monitoring efficiency, processing and analyzing. 

Downloadable Files

Air Agitation Sparging Systems for Electroplating Applications
Aluminum Alloy EN Plating Cycles
Conversion Table for Electroplating
Cyanide-Free Gold Plating Solutions for Electronic Connector Plating
Gold Cathode Current Efficiency Analysis
Interfacial Surface Mount Solder Joint Best Practice Recommendations
Lead Free Solder Alternatives
Nickel Sulfamate Purification Procedures
Physical Properties of Electrodeposited Nickel
Pilot Line Testing of a New, High-Speed Sulfate-Based Tinplate Process
Preparation of Foil Samples for Purity and Hardness Analysis
Procedure for the Preparation of Foils for Physical Analysis
Procedure for the Preparation of Mandrels for Hardness Analysis
Solder Alloy Melting Temperatures
Specifications for Low Alpha Lead Wafer in Bump Applications
Specifications for Bar Code Symbols on Electrodeposits
Techni Gold® 434 HS
Titanium Anode Basket Specification
Typical Copper, Brass or Bronze Alloy EN Plating Cycles
Typical Ferrous Alloy EN Plating Cycles
Typical Zinc Die Cast EN Plating Cycles