New Nickel Eliminates Boric Acid Toxicity Concerns in Semiconductor Manufacturing

Elevate^® Ni 5950 Offers a Boric Acid Free Alternative

Cranston, RI, USA - In response to concerns in the semiconductor industry over reports on boric acid effects on human reproduction, Technic has developed a nickel plating process free of boric acid. Elevate^® Ni 5950 eliminates concerns related to toxicity by offering a nickel deposit that is equal or better than a standard boric acid nickel sulfamate bath.

Technic’s Elevate^® Ni 5950 is capable of running at a wide current density range of 1–10 ASD. Deposit properties such as stress, ductility, tensile strength, elongation, grain structure and corrosion resistance are all very similar to a standard nickel solution.

Elevate^® Ni 5950 can be easily installed on existing nickel plating tools without any modifications to the plating cell. The process is currently being beta site tested and is available for demos in our Applications Laboratory or beta site testing at the manufacturer’s facility.

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