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Technic Showcases Advanced Semiconductor Solutions at IMAPS Device Packaging 2024 
Technic, a global leader in advanced solutions for semiconductor fabrication and packaging, is pleased to announce its participation in the Microelectronics Assembly & Advanced Packaging Conference, scheduled to take place from March 18-21, 2024, at the WeKoPa Conference Center in Fountain Hills, Arizona.
for Electroless and Immersion Plating
IMAPS Device Packaging annually brings together industry engineers, researchers, and top experts to engage in a multifaceted technical program and unique networking opportunities.
Technic will be showcasing some of their most innovative solutions in the semiconductor industry, including electroplating chemistry, photoresist strippers, metal etchants, and cleaners, as well as semiconductor equipment for small scale production and R&D.
Technic Elevate® semiconductor electroplating chemistry is known for its innovation and high quality. Elevate® processes enable high-performance electroplating for copper, nickel, tin, and precious metals, empowering semiconductor manufacturers to achieve unparalleled results.
In addition to electroplating chemistry, Technic provides photoresist strippers (TechniStrip®) for both liquid and dryfilm resist, metal etchants (TechniEtch), and cleaners (TechniClean) for various substrates used in wafer-level surface preparation.
Technic's semiconductor fabrication and packaging chemistries are widely utilized in advanced packaging platforms such as FOWLP (Fan-Out Wafer Level Packaging), Fan-In WLP, Flip Chip, and 2.5/3D integration. The company's commitment to high-performance product development, coupled with application-specific characteristics and analytical expertise, equips customers with essential tools to overcome the challenges of modern semiconductor manufacturing.
About IMAPS
The conference is a major forum for the exchange of knowledge and provides numerous technical, social, and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.
