Technic Asia Pacific expands Singapore operations

Technic Asia Pacific (TAP), Singapore: Technic has recently completed an extensive expansion and building renovation of its Singapore facility to better serve existing and future customers in the South East Asian market. The recent construction has significantly added to the locations’ applications engineering capabilities, as well as offering expanded manufacturing, warehousing, and administrative operations.

Among the major upgrades is expanded support for semiconductor technologies. The renovation included the addition of a wafer-level-packaging lab cleanroom facility that meets ISO Class 8 requirements, with specialized WLP failure analysis laboratory & WLP Plating Equipment. The new FA lab includes an SEM-EDX, Ion Mill Cross Section Polisher, ResMap system for wafer profiling, and a Research High Power Microscope. The WLP Plating Equipment currently includes Technic’s latest proprietary technology, the Semcon Fountain wafer plating tool, a RENA wafer plating tool, and an etching wet bench.

“Our expansion and renovations represent a major investment for our growing SEA customer base. For our customers, this helps us better serve and partner with them in some of the most advanced wafer and connector technologies with state of the art analytical tools and equipment. For our TAP operations, this allows us to better function and perform the critical research, applications support, and manufacturing so necessary in this highly competitive market.”

Our expansion and renovations represent a major investment for our growing SEA customer base. For our customers, this helps us better serve and partner with them in some of the most advanced wafer and connector technologies with state of the art analytical tools and equipment. For our TAP operations, this allows us to better function and perform the critical research, applications support, and manufacturing so necessary in this highly competitive market.

               KG Ng – Managing Director - TAP

The renovation and building expansion have increased the gross plot ratio from 0.67 to 1.02. The new building expansion increases the floor area from 2886 sqm to 4314 sqm. The increased floor space includes 406 sqm for production and the warehouse, 467 sqm for laboratories, and 555 sqm for offices & meeting areas