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TechniClean IK73
TechniClean IK73 is a post etch residue removal product that has been specifically targeted for the selective removal of highly-inert chemical residues created during the patterning of high-k dielectric metal oxides based on hafnium, zirconium and tantalum. Compatible with a wide range of metals and dielectrics normally present during high-k patterning, TechniClean IK73 functions at room temperature, is very easily rinsed and is suitable for immersion, batch-spray and single-wafer chemical applications.
Characteristics: Fast and selective removal of post etch residues created by plasma etching of high-k dielectric materials
Compatible with aluminum, copper dielectric materials
Designed for room temperature operation, water rinsable
Suitable for immersion, batch-spray and single wafer application
Compatible with aluminum, copper dielectric materials
Designed for room temperature operation, water rinsable
Suitable for immersion, batch-spray and single wafer application
Availability: North America, Asia Pacific, Europe
