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ASIG ESM 100 Autocatalytic Silver

PCB specific:  The deposit is tarnish resistant and gives consistent solderability.

Characteristics:

ESM 100 is an extremely stable, alkaline solution for Autocatalytic deposition of silver onto copper for 5G applications.

Availability: North America, Asia Pacific, Europe
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ASIG Techni IM Gold AT 6600

PCB specific. Immersion Gold for ASIG Process

Characteristics:

Techni IM Gold AT 6600 is a cyanide-based process that produces thin, adherent, pure gold immersion deposits onto Autocatalytic Silver substrates. Deposits are uniform and fine-grained with low porosity.

Availability: North America, Asia Pacific, Europe
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