Boric Acid Free Nickel Plating with Elevate® Ni 5950
By being boric acid free and comprised of all liquid components, Elevate® Ni 5950 eliminates concerns around boric acid toxicity and low water solubility, making it the ideal choice for wafer fabrication. Elevate® Ni 5950 produces nickel deposits equal to or better than deposits utilizing boric acid.
Watch our recorded webinar to learn more about Elevate® Ni 5950, Technic's exceptionally stable and versatile nickel plating process for semiconductor applications.
(Recorded 4/7/22)