High-Performance Etchant for Selective Removal of Titanium and Titanium Alloys


Cranston, RI, USA - Technic is pleased to announce the release of TechniEtch TBR19, a fluoride free, aqueous etchant designed to selectively remove titanium or titanium alloy (TiN, TiW) barrier layers in semiconductor fabrication and packaging applications. TBR19 has demonstrated extremely high selectivity for Ti or Ti alloys over copper, resulting in a significant reduction in undercut (<200 nm) in Cu pillar applications. TBR19 also features a tunable etch rate with a long process life, thereby improving quality, reducing cost, and ensuring consistent yields in leading edge packaging applications. TechniEtch TBR19 has been used successfully in a variety of industrial tool platforms.

We are pleased with the enthusiastic response of customers to the introduction of TechniEtch TBR19. Several high volume wafer manufacturers have already transitioned their production processes to TBR19 while a number more are finalizing their evaluations. Technic is actively expanding our manufacturing of TBR19 globally to meet rising demand.

- Anthony Gallegos, Global Product Manager, Semiconductor Technology

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TechniEtch TBR19 High Performance Etchant for Titanium and Titanium Alloys