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New Autocatalytic Silver Immersion Gold (ASIG) for Advanced PCB Applications
Technic is proud to unveil its latest innovation, the ASIG ESM 100 process, an Autocatalytic Silver with Immersion Gold technology that represents a significant advancement in PCB manufacturing. Offering superior performance compared to traditional immersion silver, ASIG is uniquely positioned to meet the needs of cutting-edge technologies like 5G, performing exceptionally well at frequencies up to 300 GHz.
Advantages of ASIG:
- Creep Corrosion Protection: ASIG prevents copper diffusion, eliminating creep corrosion, in applications without a solder mask.
- Enhanced Conductivity & Durability: The immersion gold layer provides extra protection, similar to ENIG processes, for harsh environments.
Key Features:
- Excellent RF properties: Optimized for 5G, up to 300 GHz.
- Nickel-free: Avoids issues with nickel layers.
- Ideal for wire bonding and soldering.
- Superior corrosion resistance: Long-lasting protection
- Cost-effective: High performance at a lower cost.
Benefits:
- Enhanced reliability: Provides a durable, long-lasting surface.
- Simple operation: Features automatic additions and analysis.
- Stable, long-life process: Predictable results and extended bath life.
- AOI-friendly: Compatible with Automated Optical Inspection systems.
- Minimal signal loss: Lowest signal loss for high-frequency applications.
Performance and Applications:
The ASIG ESM 100 process eliminates common issues of nitrate-based immersion silver, like creep corrosion and champagne voids. It forms a uniform deposit that protects copper without damaging the solder mask or creating cavities, improving reliability and durability, even in tough environments.
ASIG ESM 100 is suitable for both horizontal and immersion equipment, making it versatile for various setups. Its sealed surface boosts conductivity and ensures stable operation, making it ideal for 5G applications and beyond.
