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Technipad IS 7070
PCB specific: Stable, non-cyanide, immersion silver for deposition onto copper and copper alloys. The deposit is tarnish resistant and gives consistent solderability. Nitrate free.
Characteristics:
TechniPad IS 7070 is an extremely stable, nitrate free, slightly alkaline solution for immersion deposition of silver onto copper and copper-based alloys.
Availability: North America, Europe