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Elevate Cu 3000

Electrolytic copper plating process formulated to plate various types of semiconductor advanced packaging structures. It can successfully plate RDL patterns, copper pillars and most other types of features required for Fan-In, Fan-Out, 2.5D and 3D applications.

Characteristics:

Versatile process that can plate various types of features.  Excellent WID and WIW.  Very stable additive package.  All inorganic and organic components are easily analyzed using Technic’s Elevate Analyzer.

Availability: North America, Asia Pacific, Europe
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