Begin your search by selecting the Application, Process and Category or by specifying keyword(s)

Optional Filters

Process Results (1) Request More Information

Elevate Cu 1500

MSA based copper process specially formulated for producing copper deposits with excellent via fill and leveling capability. The process can be used to fill vias of various sizes with void free copper deposits that will meet the requirements of most advanced packaging applications.

Characteristics:

Excellent via fill capability.  Only two organic components to control.  All organic and inorganic components are fully analyzable with Technic’s Elevate Analyzer.

Availability: North America, Asia Pacific, Europe
Aggiungi
Finish Request