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Process Results (4) Request More Information

TechniEtch AC35

Gold (Au) and copper (Cu) etchant offering minimal metal undercutting while performing an effective etching of each or both metals.

Characteristics:

Etchant offering minimal metal undercutting while performing an effective etching of each or both metals.

Availability: North America, Asia Pacific
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TechniEtch ACI2

Gold Etchant

Characteristics: Iodine based metal etchant for use with selective gold applications.
Availability: North America, Asia Pacific, Europe
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TechniEtch CN10

Copper Seed Layer Etchant

Characteristics: Provides selective etch and high loading capacity for UBM and RDL applications. Used also for selective Cu/Ni in UBM stack because of its great etching metal selectivity.
Availability: North America, Asia Pacific, Europe
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TechniEtch TBR19

Ti, TiN, and TiW Etchant

Characteristics: Barrier layer remover for WLP applications. Solution provides great process window resulting in minimal to zero undercut while etching both metals.
Availability: North America, Asia Pacific, Europe
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Equipment Results (2) Request More Information

RTA

Analysis of organic & inorganic levels in acid copper plating solution

Characteristics:

The RTA is an automated, on-line, real-time, and in-tank system for monitoring and controlling the levels of chemical constituents of plating baths.

Availability: Asia Pacific
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Test Cell

Wafer plating test cell

Characteristics:

Fully operational, tabletop wafer plating cell for process testing and analysis.

Availability: North America, Asia Pacific, Europe
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