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TechniEtch AT 2000 is an ammonia-free, fine topography persulfate micro etch designed for use in pretreatment cycles for printed circuit boards and other copper surfaces.

Techni IM Gold AT8000 is a cyanide-free process that produces thin, adherent, pure gold immersion deposits onto electroless nickel substrates. Deposits are uniform and fine-grained with low porosity.

Techni X-Cell 318 is a liquid acid cleaner formulated for the removal of oxides, fingerprints, light oils, and other soils from copper or copper alloys.

Technic EN AT 5600 IMP is an advanced, electroless nickel that produces a deposit with 6 – 9% w/w phosphorus.
It is specifically formulated for use with TechniPad ENIG and TechniPad ENEPIG processes for printed circuit boards and meets IPC4552 A and B.

Technic EN 5810 is an advanced, electroless nickel process that produces a deposit with 10 – 13% w/w phosphorus. It is specifically formulated for use with TechniPad ENIG and TechniPad ENEPIG processes for printed circuit boards and meets IPC4552 A and B.

TechniCatalyst AT4608 is a chloride-free, organo-metallic activator specifically designed to produce an immersion palladium deposit for the complete and uniform initiation of electroless nickel such as Techni EN AT 5600 IMP or EN  5810 on Copper.

TechniClean 207AP is a liquid low-foam acid cleaner formulated for the removal of oxides, fingerprints, light oils, and other soils from copper or copper alloys.

TechniClean TH 1020 is an acidic NPTH cleaner designed to stop electroless nickel from depositing in non-plated through holes. It renders catalyst residues left behind by electroless copper processes inactive, stopping electroless nickel from depositing.

TechniPad Au 6100 is a cyanide-based immersion gold plating process designed to provide a controlled deposition of thin pure gold deposits onto electroless nickel and electroless palladium.