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Process Results (7) Request More Information
CUCN-Bright Copper Cyanide Process
Cyanide Copper Plate
Characteristics: To provide a protective coat of copper over the base protect prior to subsequent plating.
Availability: North America
Glance Cu 9002
Electrolytic alkaline copper process. Additives are lead free.
Characteristics:
- Bright process
- Excellent stability
- Cyanide-based
Availability: Europe
Techni Copper C
Semi-bright cyanide copper strike
Characteristics:
Semi bright strike process. Recommended for difficult to plate metals.
Availability: North America, Asia Pacific
Techni Copper LUX
Acidic electrolytic copper plating process.
Characteristics: Produces micro-bright, micro-pitting free and ductile deposit
High thickness and excellent corrosion resistance
Can be used with cathode agitation or air insufflation as well
High thickness and excellent corrosion resistance
Can be used with cathode agitation or air insufflation as well
Availability: North America, Europe
Techni Copper P
Alkaline Copper
Characteristics: A semi to bright pyrophosphate copper solution used as an alternative to copper cyanide.
Availability: North America
Techni Cu 2300
Acid copper electroplating process designed for printed circuit board and reel-to-reel applications.
Characteristics: Specifically engineered to produce bright and even deposits from a stable electrolyte
High purity and fine grained equiaxed deposits
Economical to use
High purity and fine grained equiaxed deposits
Economical to use
Availability: Europe
Techni CU Satin
Electroplating process that produces a smooth satin deposit.
Characteristics: Provides a fine grained, equiaxed high purity and ductile deposit
Specifically engineered for plating uniform satin, even deposits from a stable electrolyte
Economical solution with only one additive to manage
Specifically engineered for plating uniform satin, even deposits from a stable electrolyte
Economical solution with only one additive to manage
Availability: Europe