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Process Results (18) Request More Information
Convergence Nickel EF BF
Produces a low stress, ductile nickel deposit from a matte nickel sulfamate solution that is free of all boron compounds.
- Completely free of all boron compounds
- Low stress, highly ductile deposits, capable of plating at a wide range of current densities from 5 - 400 ASF (0.5-40 ASD)
- All liquid products; no handling or additions of solids
Glance 189 L
Uniform nickel brightener
Glance 374/G
Leveling bright nickel
Glance 91 S/A
Leveling bright nickel
Glance CSF
Semi-bright nickel process that produces a highly leveled and ductile deposit exhibiting exceptional corrosion protection when used as the undercoat in a duplex nickel system.
Leveling equal to or better than that from Coumarin-based system
S.T.E.P. and ductility values meet all automotive OEM specifications
Easy conversion from other semi-bright nickel plating system
Glance HB
Semi-bright nickel process permitting to deposit the first nickel layer in the double nickel plating application and suitable for electronic and electromechanical industries.
Goldeneye Black Nickel
Goldeneye Black Nickel produces a dark nickel/zinc (Ni/Zn) alloy finish on top of an electroplated nickel deposit. The appearance of the Goldeneye Black Nickel deposit varies from dark grey to black depending on the operating parameters and equipment used.
Goldeneye Nickel BF
Goldeneye Nickel BF is a low stress/highly corrosion-resistant nickel plating process capable of operation over a wide range of current densities from a proprietary electrolyte. Noted for its superior thickness distribution, improved corrosion-resistance, and lower waste treatment costs, Goldeneye Nickel BF can be utilized in reel to reel, rack and barrel plating applications. Goldeneye Nickel BF uses a revolutionary new buffering agent (Goldeneye Ni Buffer BF) which is completely free of all boron compounds.
Improved corrosion resistance compared to sulfate or sulfamate plating processes. Superior thickness distribution. Improved low current density coverage. Increased solution conductivity. Reduced waste treatment costs. Operates over a wide current density range, reel to reel, rack and barrel. Produces a nickel deposit which meets the requirements of AMS-QQ-N-290B (Rev. 2009-07), Class 1, “SB”. Completely free of all boron compounds.
Goldeneye Nickel Phos
Boric acid-free electrolytic nickel-phosphorous alloy plating process.
- Produces NiP alloys with ≥10% phosphorous consistently. Can also be used for mid-phos applications where required.
- Possible EN replacement.
- Suitable for barrel, rack, and reel-to-reel applications.
Goldeneye Nickel-Iron BF
Goldeneye Nickel Iron-BF is a unique process specifically designed to deposit an 80/20 Ni/Fe alloy in various applications, especially where a highly magnetic coating is desired.
Boric acid-free electrolyte. Highly magnetic coating. High level of solution stability and very stable alloy composition: 80/20 Ni/Fe.
MX8-M
Nickel Plate
Techni Buffer IG
Product replaces boric acid in nickel bath (sulfate base, sulphammate and Goldeneye)
Techni Buffer NiF
Product replaces boric acid in all nickel baths (sulfate base, sulphammate and Goldeneye processes).
- Nickel-free product
- Liquid product, easy to handle in replenishment.
- Aids in reducing brighteners additive in replenishment.
Techni Ni 19 L
Formaldehyde-free nickel brightener. Nickel brightener with mirror finishing for rack and barrel applications
Bright and white deposit. Ductile and levelled. Easy to manage.
Techni Nickel S-BF
Designed to produce a low stress, semi-bright, ductile nickel deposit for electronics applications in rack/barrel and SBE plating equipment. The process uses a revolutionary new buffering agent (Technic Nickel Buffer BF), which is completely free of all boron compounds.
- Completely free of all boron compounds
- Low stress, ductile deposits with good corrosion resistance
- All liquid products; no handling or additions of solids
- Can be used with either sulfate or sulfamate electrolyte
Techni NiPhos 611
Electrolytic nickel-phosphorous alloy plating process.
- Capable of depositing mid phosphorous containing nickel/phosphorous alloys (5-8% P).
- Ideal choice for high speed, mid phosphorous applications.
- Excellent solderability.
- Superior corrosion resistance.
Techniphos 615
Boric acid-free electrolytic nickel-phosphorous alloy plating process.
- Capable of depositing high phosphorous containing nickel/phosphorous alloys (≥10% P).
- Non-magnetic deposit, suitable for high frequency/5G applications.
- Improves corrosion resistance significantly compared to pure nickel barrier layers.
- Can be utilized in reel-to-reel or barrel plating applications.
