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Process Results (6) Request More Information
Tarniban E260
Post treatment process for tin and tin alloys
Techni Neutralizer E-260
Post treatment process for tin and tin alloys
Techni Nickel HT-2
PCB specific: Sulfate Nickel For High Aspect Ratio Deep tank Operation
Techni Nickel HT-2 is an advanced nickel electroplating process specifically engineered to significantly improve nickel thickness distribution vs standard sulfamate or sulfate solutions. Techni Nickel HT-2 increases nickel thickness inside blind vias and high aspect ratio through holes.
Techni Nickel S
Low stress, semi-bright, ductile nickel plating process
Sulfate or sulfamate, semi-bright, general purpose nickel underplate or final finish. Wide operational window and control parameters. Uses nickel bromide for anode corrosion.
Techni Nickel S-BF
Designed to produce a low stress, semi-bright, ductile nickel deposit for electronics applications in rack/barrel and SBE plating equipment. The process uses a revolutionary new buffering agent (Technic Nickel Buffer BF), which is completely free of all boron compounds.
- Completely free of all boron compounds
- Low stress, ductile deposits with good corrosion resistance
- All liquid products; no handling or additions of solids
- Can be used with either sulfate or sulfamate electrolyte
