Begin your search by selecting the Application, Process and Category or by specifying keyword(s)

Optional Filters

Process Results (2) Request More Information

Pallamerse

PCB specific: Immersion Palladium, dense pore free deposit.

Characteristics:

Pallamerse is an immersion palladium process that applies a dense, pore-free coating of palladium on base metals like copper, silver and nickel. Used as a Catalyst for EPIG.

Availability:
Add

Pallamerse

PCB specific: Immersion Palladium, dense pore free deposit.

Characteristics:

Pallamerse is an immersion palladium process that applies a dense, pore-free coating of palladium on base metals like copper, silver and nickel. Used as a Catalyst for EPIG

Availability:
Add
Finish Request