Begin your search by selecting the Application, Process and Category or by specifying keyword(s)

Optional Filters

Process Results (1) Request More Information

Elevate Tin 5011

Tin Plating

Characteristics: Elevate Tin 5011 is a high speed electroplating process specifically designed for bump plating of pure tin in wafer plating applications especially as a solder cap for copper pillars.
Availability: North America, Asia Pacific, Europe
Add

Equipment Results (2) Request More Information

RTA

Analysis of organic & inorganic levels in acid copper plating solution

Characteristics:

The RTA is an automated, on-line, real-time, and in-tank system for monitoring and controlling the levels of chemical constituents of plating baths.

Availability: Asia Pacific
Add

Test Cell

Wafer plating test cell

Characteristics:

Fully operational, tabletop wafer plating cell for process testing and analysis.

Availability: North America, Asia Pacific, Europe
Add
Finish Request