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Process Results (7) Request More Information
Circudep EC AC 77
PCB specific: Accelerator, electroless copper process.
CIRCUDEP EC AC 77 is a non-fluoride product that optimizes catalyst activity on non-conductive substrates, providing void-free electroless copper deposits.
CIRCUDEP EC CC 18
PCB specific: Cleaner Conditioner for Electroless Copper process.
CIRCUDEP EC CC 18 contains conditioning agents which activate glass fibers, epoxy and other non- conductive materials, allowing for a reliable absorption of the palladium catalyst in Electroless Copper processing.
Circudep EC CT 74
PCB specific: Catalyst for Electroless Copper.
CIRCUDEP EC CT 74 provides a highly charged colloid that promotes a uniform, highly adherent electroless copper deposit.
Circudep EC EC 92
PCB specific: Electroless Copper bath.
CIRCUDEP EC EC 92 is a medium-depth electroless copper system engineered to deposit a pure, fine-grained, equiaxed copper. CIRCUDEP EC EC 92 is engineered to work with today’s sophisticated non-conductive substrates.
Circudep EC PD 70
PCB specific: Catalyst predip for Electroless Copper.
CIRCUDEP EC PD 70 is a neutral solution that prepares non-conductive substrate materials for uniform absorption of the palladium catalyst.
Techni AT 66
PCB specific: Anti Tarnish for Copper.
Techni AT 66 contains a concentrated blend of copper oxide protection agents. It is added to the final rinse waters and will provide temporary tarnish protection for copper.
