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Process Results (6) Request More Information
Circudep DM AC 170
PCB specific: Accelerator for Direct metalization.
CIRCUDEP DM AC 170 is the final step in the Direct Metallization plating process. It is used after the CIRCUDEP DM CT 60 activator solution and produces the final conductive coating.
Circudep DM CC 124
PCB specific: Cleaner Conditioner for Direct Metallization.
CIRCUDEP DM CC 124 is a concentrated blend of surfactants and wetting agents designed to clean the copper foil surfaces of printed circuit boards. It contains conditioning agents which activate glass fibers and epoxy.
Circudep DM CT 60
PCB specific: Catalyst for direct metalization.
CIRCUDEP DM CT 60 is designed to help produce a conductive coating on non-conductive surfaces for Direct Metallization.
Circudep DM PD 55
PCB specific: Catalyst predip for Direct Metalization.
CIRCUDEP DM PD 55 is an acidic-salts solution designed to improve the efficiency of the Catalyst.
Techni AT 66
PCB specific: Anti Tarnish for Copper.
Techni AT 66 contains a concentrated blend of copper oxide protection agents. It is added to the final rinse waters and will provide temporary tarnish protection for copper.
