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Process Results (2) Request More Information
Pallamerse
PCB specific: Immersion Palladium, dense pore free deposit.
Characteristics:
Pallamerse is an immersion palladium process that applies a dense, pore-free coating of palladium on base metals like copper, silver and nickel. Used as a Catalyst for EPIG
Availability:
TechniCatalyst AT 4608
PCB specific: Organo-metalic Palladium Catalyst for activation of Cu surface for ENIG and ENEPIG process.
Characteristics:
TechniCatalyst AT4608 is a chloride-free, organo-metallic activator specifically designed to produce an immersion palladium deposit for the complete and uniform initiation of electroless nickel such as Techni EN AT 5600 IMP or EN 5810 on Copper.
Availability: North America, Asia Pacific, Europe