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Process Results (9) Request More Information
TechniEtch AT 2000
PCB specific: Pre-clean.
TechniEtch AT 2000 is an ammonia-free, fine topography persulfate micro etch designed for use in pretreatment cycles for printed circuit boards and other copper surfaces.
Techni X-Cell 318
PCB specific: Pattern Plate Pre-clean
Techni X-Cell 318 is a liquid acid cleaner formulated for the removal of oxides, fingerprints, light oils, and other soils from copper or copper alloys.
Technic EN 5600 IMP
Lead and cadmium-free medium phosphorus electroless nickel.
PCB specific: Electroless Nickel, mid Phos, RoHS compliant electroless nickel.
Technic EN AT 5600 IMP is an advanced, electroless nickel that produces a deposit with 6 – 9% w/w phosphorus.
It is specifically formulated for use with TechniPad ENIG and TechniPad ENEPIG processes for printed circuit boards and meets IPC4552 A and B.
Technic EN 5810
PCB specific: High Phos Electroless Nickel, Low Thickness for 5G.
Technic EN 5810 is an advanced, electroless nickel process that produces a deposit with 10 – 13% w/w phosphorus. It is specifically formulated for use with TechniPad ENIG and TechniPad ENEPIG processes for printed circuit boards and meets IPC4552 A and B.
TechniCatalyst AT 4608
PCB specific: Organo-metalic Palladium Catalyst for activation of Cu surface for ENIG and ENEPIG process.
TechniCatalyst AT4608 is a chloride-free, organo-metallic activator specifically designed to produce an immersion palladium deposit for the complete and uniform initiation of electroless nickel such as Techni EN AT 5600 IMP or EN 5810 on Copper.
TechniClean 207AP
PCB specific: Acid cleaner, spay or soak.
TechniClean 207AP is a liquid low-foam acid cleaner formulated for the removal of oxides, fingerprints, light oils, and other soils from copper or copper alloys.
TechniClean TH 1020
PCB specific: Acid cleaner for ENIG & ENEPIG
TechniClean TH 1020 is an acidic NPTH cleaner designed to stop electroless nickel from depositing in non-plated through holes. It renders catalyst residues left behind by electroless copper processes inactive, stopping electroless nickel from depositing.
Technipad 7611
PCB specific: Electroless Palladium, Pure Palladium deposit.
TechniPad 7611 is a stable, autocatalytic, electroless palladium plating solution. It is designed to deposit a pure palladium deposit on electroless nickel to improve solderability and provide a surface for both aluminum and gold wire bonding.
Technipad AU 6100
PCB specific: Immersion Gold, controlled deposition, Cyanide base chemistry. For ENIG and ENEPIG.
TechniPad Au 6100 is a cyanide-based immersion gold plating process designed to provide a controlled deposition of thin pure gold deposits onto electroless nickel and electroless palladium.