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Process Results (6) Request More Information
Technic High-Speed Nickel Sulfamate FFP
PCB Specific
Technic High-Speed Nickel Sulfamate FFP process is designed for high speed, high current density applications to produce a low stress, semi-bright, ductile nickel deposit. The bath can be used with soluble or insoluble anodes.
Goldeneye Nickel Phos
Boric acid-free electrolytic nickel-phosphorous alloy plating process.
- Produces NiP alloys with ≥10% phosphorous consistently. Can also be used for mid-phos applications where required.
- Possible EN replacement.
- Suitable for barrel, rack, and reel-to-reel applications.
Techni Nickel HT-2
PCB specific: Sulfate Nickel For High Aspect Ratio Deep tank Operation
Techni Nickel HT-2 is an advanced nickel electroplating process specifically engineered to significantly improve nickel thickness distribution vs standard sulfamate or sulfate solutions. Techni Nickel HT-2 increases nickel thickness inside blind vias and high aspect ratio through holes.
Techni NiPhos 611
Electrolytic nickel-phosphorous alloy plating process.
- Capable of depositing mid phosphorous containing nickel/phosphorous alloys (5-8% P).
- Ideal choice for high speed, mid phosphorous applications.
- Excellent solderability.
- Superior corrosion resistance.
Technic High-Speed Nickel Sulfamate FFP
PCB specific
Technic High-Speed Nickel Sulfamate FFP process is designed for high-speed, high current density applications to produce a low-stress, semi-bright, ductile nickel deposit. The bath can be used with soluble or insoluble anodes.
Techniphos 615
Boric acid-free electrolytic nickel-phosphorous alloy plating process.
- Capable of depositing high phosphorous containing nickel/phosphorous alloys (≥10% P).
- Non-magnetic deposit, suitable for high frequency/5G applications.
- Improves corrosion resistance significantly compared to pure nickel barrier layers.
- Can be utilized in reel-to-reel or barrel plating applications.