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Process Results (7) Request More Information
CUCN
Cyanide copper strike and full build
Characteristics: Bright cyanide copper especially design for difficult to plate substrates such as leaded brass.
Availability: North America, Asia Pacific
Glance Cu 160
Copper plating, no cyanide.
Characteristics:
Cyanide free, alkaline Copper plating solution for all metals even for zamak.
Availability: Europe
Glance Cu 9002
Electrolytic alkaline copper process. Additives are lead free.
Characteristics:
- Bright process
- Excellent stability
- Cyanide-based
Availability: Europe
Techni Copper C
Semi-bright cyanide copper strike
Characteristics:
Semi bright strike process. Recommended for difficult to plate metals.
Availability: North America, Asia Pacific
Techni Copper LUX
Acidic electrolytic copper plating process.
Characteristics: Produces micro-bright, micro-pitting free and ductile deposit
High thickness and excellent corrosion resistance
Can be used with cathode agitation or air insufflation as well
High thickness and excellent corrosion resistance
Can be used with cathode agitation or air insufflation as well
Availability: North America, Europe
Techni Cu No Dyes
Dye free acid copper plating bath, producing a bright deposit.
Characteristics: Stable process
Very bright
Excellent throwing power
Very bright
Excellent throwing power
Availability: Europe
Techni CU Satin
Electroplating process that produces a smooth satin deposit.
Characteristics: Provides a fine grained, equiaxed high purity and ductile deposit
Specifically engineered for plating uniform satin, even deposits from a stable electrolyte
Economical solution with only one additive to manage
Specifically engineered for plating uniform satin, even deposits from a stable electrolyte
Economical solution with only one additive to manage
Availability: Europe
