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Application

Process

Process Results (6) Request More Information

Remova 205

Copper alloy pickling

Characteristics: Pickling and brightening agent.

Availability: Europe

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Remova 2055

Additive for dipping

Characteristics: Supporting additive for pickling solutions and degreasers.

Availability: Europe

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Remova 3021

Pickling agent for silver

Characteristics: Pickling, antioxidant and activator for silver

Availability: Europe

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Remova 8068

Pickling for zamak

Characteristics: Pickling and degreasing action.

Availability: Europe

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Techni Acid Salt TAS-1

Powder acid activator for steel, brass, copper and passive nickel.

Characteristics: Non-flouride blend of dry acid salts for pickling metals prior to electroplating. Replaces mineral acids such as sulfuric and hydrochloric acid. Used to activate all base metals.

Availability: North America, Asia Pacific

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Techni Acid Salt TAS-3Z

Powder acid activator for zinc die cast, leaded brass, beryllium copper, aluminum, nickel, silver, tin, lead.

Characteristics: Blend of dry acid salts with flouride used for pickling metals prior to electroplating. For nickel alloys, copper, and brass activation. Similar to TAS-1, but more aggressive for hard-to-activate surfaces.

Availability: North America

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Equipment Results (6) Request More Information

Ancillary Plating Equipment

Upgrades, spare or replacement parts for all plating operations

Characteristics:

DC rectifiers, PPR rectifiers, amp hour meters, heaters, filters, ultrasonics, spare parts, retrofits and upgrades.

Availability: North America

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CDPP-2000

Controlled Depth Pin Processing

Characteristics:

Continuous, fully enclosed, controlled depth processor for pin plating. Fully automatic cartridge loading and unloading with fast and easy part changeovers.

Availability: North America, Asia Pacific, Europe

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