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Process Results (15) Request More Information
Convergence Nickel EF BF
Produces a low stress, ductile nickel deposit from a matte nickel sulfamate solution that is free of all boron compounds.
- Completely free of all boron compounds
- Low stress, highly ductile deposits, capable of plating at a wide range of current densities from 5 - 400 ASF (0.5-40 ASD)
- All liquid products; no handling or additions of solids
Goldeneye Black Nickel
Goldeneye Black Nickel produces a dark nickel/zinc (Ni/Zn) alloy finish on top of an electroplated nickel deposit. The appearance of the Goldeneye Black Nickel deposit varies from dark grey to black depending on the operating parameters and equipment used.
Goldeneye Level Nickel HS
Goldeneye Level Nickel HS is an advanced electroplating process specifically designed to produce fully bright lustrous nickel deposits at high current densities, suitable for decorative applications.
Goldeneye Nickel BF
Goldeneye Nickel BF is a low stress/highly corrosion-resistant nickel plating process capable of operation over a wide range of current densities from a proprietary electrolyte. Noted for its superior thickness distribution, improved corrosion-resistance, and lower waste treatment costs, Goldeneye Nickel BF can be utilized in reel to reel, rack and barrel plating applications. Goldeneye Nickel BF uses a revolutionary new buffering agent (Goldeneye Ni Buffer BF) which is completely free of all boron compounds.
Improved corrosion resistance compared to sulfate or sulfamate plating processes. Superior thickness distribution. Improved low current density coverage. Increased solution conductivity. Reduced waste treatment costs. Operates over a wide current density range, reel to reel, rack and barrel. Produces a nickel deposit which meets the requirements of AMS-QQ-N-290B (Rev. 2009-07), Class 1, “SB”. Completely free of all boron compounds.
Goldeneye Nickel EF
Goldeneye Nickel EF is an advanced electroplating process specifically designed to produce fully bright lustrous nickel deposits over a wide range of current densities. The ability to produce ductile heavy deposits with very low stress makes this process especially suitable for electroforming applications.
Excellent ductility at high deposit thicknesses, especially suited for electroforming applications.
Goldeneye Nickel Phos
Boric acid-free electrolytic nickel-phosphorous alloy plating process.
- Produces NiP alloys with ≥10% phosphorous consistently. Can also be used for mid-phos applications where required.
- Possible EN replacement.
- Suitable for barrel, rack, and reel-to-reel applications.
Goldeneye Nickel Tungsten
Goldeneye Nickel Tungsten is designed to deposit a Ni/W alloy in applications requiring superior corrosion resistance, mechanical strength, high hardness, excellent wear, and other properties. It is suitable for reel to reel, rack or barrel plating equipment. Goldeneye Nickel Tungsten requires no special rectification and the process can be implemented in existing plating lines with minimal to no modifications.
High hardness with excellent wear and mechanical properties
Non-magnetic coating, suitable for high frequency applications (5G)
DC plating; no special rectification required
Goldeneye Nickel-Iron BF
Goldeneye Nickel Iron-BF is a unique process specifically designed to deposit an 80/20 Ni/Fe alloy in various applications, especially where a highly magnetic coating is desired.
Boric acid-free electrolyte. Highly magnetic coating. High level of solution stability and very stable alloy composition: 80/20 Ni/Fe.
Goldeneye Satin Nickel
Goldeneye Satin Nickel is a unique electroplating process which produces a smooth satin nickel deposit in applications requiring this finish.
Designed for use in rack or medium speed reel-to-reel plating equipment.
High Speed Nickel Sulfamate FFP BF
High speed nickel sulfamate plating process.
High speed Nickel plating process producing low stress, ductile nickel deposits. Also available in boric acid-free version FFP-BF.
Techni Nickel S
Low stress, semi-bright, ductile nickel plating process
Sulfate or sulfamate, semi-bright, general purpose nickel underplate or final finish. Wide operational window and control parameters. Uses nickel bromide for anode corrosion.
Techni Nickel S-BF
Designed to produce a low stress, semi-bright, ductile nickel deposit for electronics applications in rack/barrel and SBE plating equipment. The process uses a revolutionary new buffering agent (Technic Nickel Buffer BF), which is completely free of all boron compounds.
- Completely free of all boron compounds
- Low stress, ductile deposits with good corrosion resistance
- All liquid products; no handling or additions of solids
- Can be used with either sulfate or sulfamate electrolyte
Techni Nickel TS
High speed nickel sulfamate plating process.
Techni NiPhos 611
Electrolytic nickel-phosphorous alloy plating process.
- Capable of depositing mid phosphorous containing nickel/phosphorous alloys (5-8% P).
- Ideal choice for high speed, mid phosphorous applications.
- Excellent solderability.
- Superior corrosion resistance.
Techniphos 615
Boric acid-free electrolytic nickel-phosphorous alloy plating process.
- Capable of depositing high phosphorous containing nickel/phosphorous alloys (≥10% P).
- Non-magnetic deposit, suitable for high frequency/5G applications.
- Improves corrosion resistance significantly compared to pure nickel barrier layers.
- Can be utilized in reel-to-reel or barrel plating applications.
