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Process Results (6) Request More Information
Technic EN 5600 IMP
Lead and cadmium-free medium phosphorus electroless nickel.
PCB specific: Electroless Nickel, mid Phos, RoHS compliant electroless nickel.
Technic EN AT 5600 IMP is an advanced, electroless nickel that produces a deposit with 6 – 9% w/w phosphorus.
It is specifically formulated for use with TechniPad ENIG and TechniPad ENEPIG processes for printed circuit boards and meets IPC4552 A and B.
Technic EN 5810
PCB specific: High Phos Electroless Nickel, Low Thickness for 5G.
Technic EN 5810 is an advanced, electroless nickel process that produces a deposit with 10 – 13% w/w phosphorus. It is specifically formulated for use with TechniPad ENIG and TechniPad ENEPIG processes for printed circuit boards and meets IPC4552 A and B.
Technipad 7611
PCB specific: Electroless Palladium, Pure Palladium deposit.
TechniPad 7611 is a stable, autocatalytic, electroless palladium plating solution. It is designed to deposit a pure palladium deposit on electroless nickel to improve solderability and provide a surface for both aluminum and gold wire bonding.
Technipad AU 6100
PCB specific: Immersion Gold, controlled deposition, Cyanide base chemistry. For ENIG and ENEPIG.
TechniPad Au 6100 is a cyanide-based immersion gold plating process designed to provide a controlled deposition of thin pure gold deposits onto electroless nickel and electroless palladium.
Technipad AU 6100
PCB specific.
TechniPad Au 6100 is a cyanide-based immersion gold plating process designed to provide a controlled deposition of thin pure gold deposits onto electroless nickel and electroless palladium.
Technipad IS 7070
PCB specific: Stable, non-cyanide, immersion silver for deposition onto copper and copper alloys. The deposit is tarnish resistant and gives consistent solderability. Nitrate free.
TechniPad IS 7070 is an extremely stable, nitrate free, slightly alkaline solution for immersion deposition of silver onto copper and copper-based alloys.
